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The primary built-in circuit (IC) memory chip appeared in 1971. IC memory stores a bit in a transistor-capacitor combination. The capacitor holds a charge to signify a 1 and no cost for a zero; the transistor switches it between these two states. As a result of a capacitor charge step by step decays, IC memory is dynamic RAM (DRAM), which must have its saved values refreshed periodically (each 20 milliseconds or so). There’s also static RAM (SRAM), which doesn’t must be refreshed. Though quicker than DRAM, SRAM makes use of extra transistors and is thus more expensive; it is used primarily for CPU internal registers and cache memory.
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The IC itself is fashioned on a silicon wafer reduce from a cylinder of pure silicon—now generally 200-300 mm (8-12 inches) in diameter. Since more chips may be minimize from a bigger wafer, the material unit value of a chip goes down with rising wafer size. A photographic image of each layer of the circuit design is made, and photolithography is used to show a corresponding circuit of resist” that has been put on the wafer. The unwanted resist is washed off and the exposed materials then etched. This course of is repeated to type numerous layers, with silicon dioxide (glass) used as electrical insulation between layers.